Taiwan Semiconductor Manufacturing Company

TSMsupplier

TSMC is the world's largest dedicated semiconductor foundry, manufacturing chips designed by NVIDIA, Apple, AMD, Qualcomm, and most leading chipmakers. Its monopoly on extreme-ultraviolet (EUV) lithography at scale makes it the single most critical node in the global semiconductor supply chain.

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Produkte & Umsatz

Umsatzanteil nach Produkt

Umsatzaufschlüsselung ($95.4B)

Statische Daten (Echtzeitfinanzen werden geladen…)

High Performance Computing (52%)

Smartphone (26%)

IoT (8%)

Automotive (8%)

Digital Consumer Electronics (6%)

Segmentzusammensetzung und Hauptkunden

Produktdetails

3nm Process (N3E/N3P)28%

Cutting-edge 3-nanometer FinFET fabrication for mobile and HPC chips

5nm Process (N5/N4P)35%

Mainstream advanced node for GPUs, CPUs, and mobile SoCs

7nm and Above22%

Mature nodes for automotive, IoT, and networking chips

Advanced Packaging (CoWoS)10%

Chip-on-Wafer-on-Substrate packaging for HBM-integrated AI accelerators

Mask Making & IP5%

Photomask production and design-technology co-optimization services

Lieferkettenbeziehungen

Wichtige Kunden

NVIDIA Corporation

GPU wafer fabrication

Auswirkung: $20B+ — largest single customer

Alphabet Inc. (Google)

TPU chip fabrication

Auswirkung: $4B+

Microsoft Corporation

Custom Maia AI chip fabrication

Auswirkung: $1B+

Amazon.com (AWS)

Graviton and Trainium chip fab

Auswirkung: $2B+

Wichtige Zulieferer

ASML Holding

EUV lithography systems

Auswirkung: Critical — sole EUV supplier

Applied Materials

Deposition, etch, and CMP equipment

Auswirkung: High — key equipment vendor

Lam Research

Etch and deposition systems

Auswirkung: High — key equipment vendor

KLA Corporation

Wafer inspection and metrology

Auswirkung: High — key quality control vendor

Wettbewerber

Samsung Electronics

Foundry services

Auswirkung: Samsung is distant #2 in advanced nodes

Makro- und Marktkontext

반도체Sektornachrichten

WFE(반도체 장비) 업사이클 + AI HBM 슈퍼사이클 진입

TSMC 가동률

92%+

HBM 수요 성장

+180% YoY

WFE 시장 규모

$105B (2026E)

리드타임 (장비)

18~24개월

Nächste Katalysatoren

◆TSMC Q2 실적 (2026.04.17)◆NVIDIA GB300 양산 착수 발표◆AMAT/LRCX/KLAC 실적 시즌 (2026.05)

Lieferketten-Probleme

↑ 생산 확대애리조나 N3 공정 2026H1 시험생산

2026-04

Phoenix Fab 21 N3 공정 시험 웨이퍼 투입 시작. Apple A20 칩 우선 배정, 연간 6만 장 캐파 목표.

⚡ 리스크대만 지진 리스크 — 글로벌 반도체 단일 공급 취약성

2026-02

4월 규모 6.2 지진 발생, 팹 피해 없었으나 공급망 집중 리스크 재부각. 고객사 재고 확보 요구 강화.

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