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KLA Corporation

KLACsupplier

KLA Corporation is the dominant supplier of semiconductor process-control and inspection equipment. Its tools detect nanoscale defects on wafers and reticles, making them essential for yield management at every leading-edge fab worldwide.

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Produkte & Umsatz

Umsatzanteil nach Produkt

Umsatzaufschlüsselung ($11.4B)

Statische Daten (Echtzeitfinanzen werden geladen…)

Semiconductor Process Control (82%)
Specialty Semiconductor Process (8%)
PCB, Display & Component Inspection (5%)
Services (5%)

Segmentzusammensetzung und Hauptkunden

Produktdetails

Wafer Inspection35%

Broadband plasma and e-beam defect inspection systems

Patterning Metrology25%

Overlay, CD-SEM, and scatterometry for lithography control

Reticle Inspection15%

Mask and reticle defect detection for EUV and DUV

PCB & Display Inspection10%

Inspection systems for printed circuit boards and flat panels

Services15%

Maintenance contracts, upgrades, and data analytics

Makro- und Marktkontext

WFE(반도체 장비) 업사이클 + AI HBM 슈퍼사이클 진입

TSMC 가동률

92%+

HBM 수요 성장

+180% YoY

WFE 시장 규모

$105B (2026E)

리드타임 (장비)

18~24개월

Nächste Katalysatoren

TSMC Q2 실적 (2026.04.17)NVIDIA GB300 양산 착수 발표AMAT/LRCX/KLAC 실적 시즌 (2026.05)

Lieferketten-Probleme

↑ 생산 확대2nm 계측 장비 단독 수주 확대
2026-04

N2/N2P 공정 결함 검사 솔루션 수주 집중. 경쟁사 대비 기술 격차로 고객 대체 어려워 ASP 프리미엄 유지.

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KI-Analyse

Klicken Sie auf "KI-Analyse abrufen" für eine KI-gestützte Lieferkettenanalyse von KLA Corporation.

Unternehmensinformationen

Hauptsitz

Milpitas, California, USA

Gegründet

1975

Mitarbeiter

15,500+

Website

kla.com

Kaskadenposition

Rolle in der Kaskade

late mover

Typische Verzögerung

3-5 trading days

Process-control spending is the last equipment budget to move, but rising complexity at 3nm lifts KLA's content per wafer.

Vollständige Kaskade anzeigen

Sektorübersicht반도체

Sektornachrichten

WFE(반도체 장비) 업사이클 + AI HBM 슈퍼사이클 진입

TSMC 가동률

92%+

HBM 수요 성장

+180% YoY

WFE 시장 규모

$105B (2026E)

리드타임 (장비)

18~24개월

Hauptthemen

  • AI 가속기(H100/B200) 수요 공급 불균형 지속
  • Gate-All-Around 공정 전환 → 장비 교체 사이클
  • HBM3e/HBM4 양산 경쟁 — SK하이닉스·마이크론·삼성

Nächste Katalysatoren

  • TSMC Q2 실적 (2026.04.17)
  • NVIDIA GB300 양산 착수 발표