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Lam Research

LRCXsupplier

Lam Research is a leading supplier of wafer-fabrication etch and deposition equipment. Its dominance in high-aspect-ratio etch makes it essential for 3D NAND flash scaling and increasingly important for advanced-logic patterning at 3nm and below.

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Produits et revenus

Part de revenus par produit

Répartition du chiffre d'affaires ($18.2B)

Données statiques (chargement des finances en temps réel…)

Memory (48%)
Foundry / Logic (38%)
Customer Support (14%)

Composition des segments et principaux clients

Détails du produit

Conductor Etch35%

High-aspect-ratio etch systems for 3D NAND and logic patterning

Dielectric Etch20%

Selective oxide and nitride etch for multi-patterning

Deposition (PECVD / ALD)25%

Thin-film deposition for advanced interconnects

Clean / Strip10%

Post-etch residue removal and wafer-cleaning systems

Customer Support & Services10%

Spares, upgrades, and reliant productivity solutions

Relations dans la chaîne d'approvisionnement

Clients clés

Taiwan Semiconductor Manufacturing Company

Etch and deposition systems

Impact: $4B+

Samsung Electronics

3D NAND etch equipment

Impact: $3B+

SK Hynix

DRAM and NAND etch

Impact: $2B+

Micron Technology

Etch and deposition

Impact: $1.5B+

Concurrents

Applied Materials

Etch and deposition

Impact: Primary competitor

Contexte macro et de marché

반도체Actualités du secteur

WFE(반도체 장비) 업사이클 + AI HBM 슈퍼사이클 진입

TSMC 가동률

92%+

HBM 수요 성장

+180% YoY

WFE 시장 규모

$105B (2026E)

리드타임 (장비)

18~24개월

Prochains catalyseurs

◆TSMC Q2 실적 (2026.04.17)◆NVIDIA GB300 양산 착수 발표◆AMAT/LRCX/KLAC 실적 시즌 (2026.05)

Problèmes de chaîne d'approvisionnement

★ 기회HBM 식각 장비 점유율 확대
2026-04

SK하이닉스 HBM4 라인 증설에 Lam 식각 장비 독점 공급. HBM 관련 매출 2026FY 30% 이상 성장 전망.

⚡ 리스크中 선진 장비 수출통제 영향 확인
2026-02

중국향 매출 비중 26%로 하락 (전년 32%). 미국 수출통제 강화로 중국 매출 구조적 감소 불가피.

Actualités récentes

Chargement des nouvelles...

Analyse IA

Cliquez sur « Obtenir l'analyse IA » pour une analyse de la chaîne d'approvisionnement de Lam Research par intelligence artificielle.

Informations sur l'entreprise

Siège social

Fremont, California, USA

Fondée en

1980

Effectifs

17,500+

Position dans la cascade

Rôle dans la cascade

late mover

Délai typique

2-5 trading days

Memory capex recovery (driven by HBM demand) flows to Lam's etch-heavy memory equipment business with a lag.

Voir la cascade complète

Aperçu du secteur — 반도체

Actualités du secteur

WFE(반도체 장비) 업사이클 + AI HBM 슈퍼사이클 진입

TSMC 가동률

92%+

HBM 수요 성장

+180% YoY

WFE 시장 규모

$105B (2026E)

리드타임 (장비)

18~24개월

Thèmes clés

  • •AI 가속기(H100/B200) 수요 공급 불균형 지속
  • •Gate-All-Around 공정 전환 → 장비 교체 사이클
  • •HBM3e/HBM4 양산 경쟁 — SK하이닉스·마이크론·삼성

Prochains catalyseurs

  • ◆TSMC Q2 실적 (2026.04.17)
  • ◆NVIDIA GB300 양산 착수 발표